Mathematics, 18.07.2020 17:01 munao4938
The thickness of photoresist applied to wafers in semiconductor manufacturing at a particular location on the wafer is uniformly distributed between 0.2046 and 0.2135 micrometers. (a) Determine the proportion of wafers that exceeds 0.2125 micrometers of photoresist thickness. (Round your answer to 3 decimal places.)
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