Describe how design elements influenced your decision to purchase a particular
object.

Describe one experiment in which the glass transition temperature and melting temperature of a totally amorphous thermoplastic material can be determined. show the relevant experimental results in a diagram which should be properly annotated with the two temperatures clearly marked. what is likely to happen to the curve in the diagram if the amorphous polymer is replaced by a thermosetting type?

Plot schematically the tensile stress versus strain curves for a typical thermoplastic material at a temperature below its glass transition temperature (tg and at a temperature above its tg, respectively. do the same for a typical thermosetting material. list in a table any differences or similarities between the two materials at t> tg and t < tg, respectively, and relate them to the structures of the two types of polymers

1in2 processor chip can be modelled as an isothermal plane wall of silicon, isothermal on both sides. the power input to the bottom of the plane wall, or the processing power of the chip, often called the thermal design power (tdp), is 100w. assume the periphery is adiabatic. the silicon is 400 microns thick. the temperature at the junction, or in this case on the bottom of the isothermal plane wall, is 85°c. what is the top surface temperature, assuming that the only mode of heat transfer is conduction