You need to lower your lift onto the mechanical load-holding devices to provide structural support before working under the lift. True or false?

If the thermal strain developed in polyimide film during deposition is given as 0.0044. assume room temperature is kept at 17.3 c, and thermal coefficient of expansion for the film and the substrate are 54 x 10^-6c^-1 and 3.3 x 10^-6c^-1respectively. calculate the deposition temperature.

Coiled springs ought to be very strong and stiff. si3n4 is a strong, stiff material. would you select this material for a spring? explain.

How to increase the thermal officiency of an ideal simple rankino cycle? among these methods, which one is the best and why?