Finned passages are frequently formed between parallel plates to enhance convection heat transfer in compact heat exchanger cores. An important application is in electronic equipment cooling, where on or more air-cooled stacks are placed between heat dissipating electrical componenets. Consider a single stack of rectangular fins of lenght L and thickness t, with convection conditions corresponding to h and T(infinity). a. Obtain expressions for the fin heat transfer rates, q and q L, in terms of the base temperatures, To and TL.
b. In a specific application, a stack that is 200 mm wide and 100 mm deep contains 50 fins, each of length L = 12mm. The entire stack is made from aluminum, which is everywhere 1.0 mm thick. If temperature limitations associated with electrical components joined to opposite plates dictate maximum allowable plate temperatures of To = 400 K and TL = 350 K, what are the corresponding maximum power dissipations if h = 150 W/m2 middot K and T infinity = 300 K?