Engineering, 13.03.2021 01:00 aud50
A thin silicon chip and an 8-mm-thick aluminum substrate are separated by a 0.02-mm-thick epoxy joint. The chip and substrate are each 10 mm on a side, and their exposed surfaces are cooled by air, which is at a temperature of 25 C and provides a convection coefficient of 100 W/m2 K. If the chip dissipates 104 W/m2 under normal conditions, will it operate below a maximum allowable temperature of 85 C
Answers: 1
Engineering, 04.07.2019 18:10
What are the two (02) benefits, which may result from a successful implementation of preventive maintenance (pm) program in an organization? (clo3)a)- lean manufacturing b)-overlapping responsibilities c)-the planner is not qualified d)-accurate contractor information e)-reduction in equipment redundancies f)-accurate stores information
Answers: 3
Engineering, 04.07.2019 18:20
Apiston-cylinder device contains 0.1 m3 of liquid water and 0.9 m3 of water vapor in equilibrium at 800 kpa. heat is transferred at constant pressure until the temperature of water reaches 350 °c. determine (a) the quality of water at the initial state (b) the work associated with this process, (c) the heat associated with this process.
Answers: 2
Engineering, 04.07.2019 19:10
A)-explain briefly the importance of standards in engineering design. b)- what is patent? c)-explain the relationship between these standards: b.s. and b.s.en d)- in engineering design concepts, types of loads and how they act are important factors. explain.
Answers: 3
Engineering, 04.07.2019 19:20
Heat transfer by is the fastest mode of heat transfer that requires no intervening medium. a)-conduction b)-convection c)-radiation d)-conduction and convection
Answers: 1
A thin silicon chip and an 8-mm-thick aluminum substrate are separated by a 0.02-mm-thick epoxy join...
Mathematics, 02.08.2019 15:30
Mathematics, 02.08.2019 15:30
History, 02.08.2019 15:30
History, 02.08.2019 15:30
History, 02.08.2019 15:30
Business, 02.08.2019 15:30