The components of a displacement field are (in meters): (a) Consider two points (2, 5, 7) and (3, 8, 9) in the undeformed configuration. Find the change in distance between these points. (b) Compute the components of the Lagrangian and the infinitesimal strain tensors. (c) Compute the components of the rotation tensor. (d) Compute, and compare, the Lagrangian strains and the infinitesimal strains at location (2, -1, 3). (e) Does this displacement field satisfy compatibility

A-mn has a cubic structure with a0 0.8931 nm and a density of 7.47 g/cm3. b-mn has a different cubic structure, with a0 0.6326 nm and a density of 7.26 g/cm3. the atomic weight of manganese is 54.938 g/mol and the atomic radius is 0.112 nm. determine the percent volume change that would occur if a-mn transforms to b-mn.

A3-mm-thick panel of aluminum alloy (k 177 w/m-k, c 875 j/kg-k and ? = 2770 kg/m) is finished on both sides with an epoxy coating that must be cured at or above t,-150°c for at least 5 min. the production line for the curing operation involves two steps: (1) heating in a large oven with air at ts,0-175°c and a convection coefficient of h, 40 w/m2. k, and (2) cooling in a large chamber with air at 25°c and a con- vection coefficient of he 10 w/m2.k. the heating portion of the process is conducted over a time interval te which exceeds the ime required to reach 150°c by 5 min (h = r + 300 s). the coating has an emissivity of ? = 0.8, and the temperatures of the oven and chamber walls are 175 and 25°c, respectively. if the panel is placed in the oven at an initial temperature of 25°c and removed from the chamber at a safe-to-touch tempera ture of 37°c, what is the total elapsed time for the two-step curing operation?

1in2 processor chip can be modelled as an isothermal plane wall of silicon, isothermal on both sides. the power input to the bottom of the plane wall, or the processing power of the chip, often called the thermal design power (tdp), is 100w. assume the periphery is adiabatic. the silicon is 400 microns thick. the temperature at the junction, or in this case on the bottom of the isothermal plane wall, is 85°c. what is the top surface temperature, assuming that the only mode of heat transfer is conduction