(Ignore my answer lol)

If the thermal strain developed in polyimide film during deposition is given as 0.0044. assume room temperature is kept at 17.3 c, and thermal coefficient of expansion for the film and the substrate are 54 x 10^-6c^-1 and 3.3 x 10^-6c^-1respectively. calculate the deposition temperature.

Draw the engineering stress-strain curve for (a) bcc; (b) fcc metals and mark important points.

The higher the astm grain size number, the finer the gran is. a)-true b)-false