Engineering, 21.10.2020 07:01 justalittle
Which of the following statements about intersystem bonding is correct?
a. Intersystem bonding is required at the service equipment but is optional at buildings supplied by a feeder.
b. Intersystem bonding is optional at the service equipment but is required at buildings supplied by a feeder.
c. Intersystem bonding is required at the service equipment and at buildings supplied by a feeder as well.
d. Intersystem bonding is required at the main distribution for mobile home parks but is not required at the disconnecting means at the mobile home.
Answers: 1
Engineering, 04.07.2019 18:10
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Engineering, 04.07.2019 19:10
Apressure vessel with an r/t 20 cannot be treated as thin walled vessel. a)-trune b)- false
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Engineering, 04.07.2019 19:10
For a process taking place in a closed system containing gas, the volume and pressure relationship is pvi-constant. -1.5 bar, the process starts with initial conditions, pi = =0.03 m3 and ends with final volume, v2-0.05 m3 determine the work done by the gas.
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Engineering, 06.07.2019 02:30
1in2 processor chip can be modelled as an isothermal plane wall of silicon, isothermal on both sides. the power input to the bottom of the plane wall, or the processing power of the chip, often called the thermal design power (tdp), is 100w. assume the periphery is adiabatic. the silicon is 400 microns thick. the temperature at the junction, or in this case on the bottom of the isothermal plane wall, is 85°c. what is the top surface temperature, assuming that the only mode of heat transfer is conduction
Answers: 1
Which of the following statements about intersystem bonding is correct?
a. Intersystem bonding is r...
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