Engineering, 14.07.2020 21:01 KindaSmartPersonn
For a permanent bolted assembly with 12 bolts, the stiffness of each bolt is kb = 3 bf/in and the stiffness of the members is km = 10 bf/in per bolt. An external load of 60 kips is applied to the entire joint. Assume the load is equally distributed to all the bolts. It has been determined to use 5/8 in-13 UNC grade 7 bolts. (a) (2 points) Determine the yielding factor of safety. (b) (2 points) Determine the factor of safety based on joint separation. (c) (2 points) Determine the load factor for overload.
Answers: 2
Engineering, 04.07.2019 18:20
Air is compressed isentropically from an initial state of 300 k and 101 kpa to a final temperature of 1000 k. determine the final pressure using the following approaches: (a) approximate analysis (using properties at the average temperature) (b) exact analysis
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Engineering, 04.07.2019 18:20
Describe one experiment in which the glass transition temperature and melting temperature of a totally amorphous thermoplastic material can be determined. show the relevant experimental results in a diagram which should be properly annotated with the two temperatures clearly marked. what is likely to happen to the curve in the diagram if the amorphous polymer is replaced by a thermosetting type?
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Engineering, 04.07.2019 19:10
Agas contained within a piston-cylinder assembly e end nation about same energy states, 1 and 2, where pi 10 bar, v undergoes two processes, a and b, between the sam 0.1 m3, ui-400 kj and p2 1 bar, v2 1.0 m2, u2 200 kj: process a: process from 1 to 2 during which the pressure- volume relation is pv constant process b: constant-volume process from state 1 to a pressure of 2 bar, followed by a linear pressure-volume process to +20 0 state 2 kinetic and potential energy effects can be ignored. for each of the processes a and b, (a) sketch the process on p-v coordinates, (b) evaluate the work, in kj, and (c) evaluate process the heat transfer, in kj
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Engineering, 06.07.2019 02:30
1in2 processor chip can be modelled as an isothermal plane wall of silicon, isothermal on both sides. the power input to the bottom of the plane wall, or the processing power of the chip, often called the thermal design power (tdp), is 100w. assume the periphery is adiabatic. the silicon is 400 microns thick. the temperature at the junction, or in this case on the bottom of the isothermal plane wall, is 85°c. what is the top surface temperature, assuming that the only mode of heat transfer is conduction
Answers: 1
For a permanent bolted assembly with 12 bolts, the stiffness of each bolt is kb = 3 bf/in and the st...
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