24. A short section of liquidtight flexible nonmetallic conduit connects the circuit conduc-
tors to a machine. The conductors are size 1 AWG copper protected by 125-ampere
time-delay fuses. The copper equipment grounding conductor required for this circuit
is not permitted to be smaller than size:
A. 6 AWG
C. 3 AWG
E. 1 AWG
B. 4 AWG
D. 2 AWG
Code reference

1in2 processor chip can be modelled as an isothermal plane wall of silicon, isothermal on both sides. the power input to the bottom of the plane wall, or the processing power of the chip, often called the thermal design power (tdp), is 100w. assume the periphery is adiabatic. the silicon is 400 microns thick. the temperature at the junction, or in this case on the bottom of the isothermal plane wall, is 85°c. what is the top surface temperature, assuming that the only mode of heat transfer is conduction