subject
Engineering, 28.11.2019 00:31 leo4687

Water flowing in a horizontal 25-cm-diameter pipe at 9 m/s and 300 kpa gage enters a 90° bend reducing section, which connects to a 15-cm-diameter vertical pipe. the inlet of the bend is 50 cm above the exit. neglecting any frictional and gravitational effects, determine the net resultant force exerted on the reducer by the water. take the momentum-flux correction factor to be 1.04.

ansver
Answers: 2

Another question on Engineering

question
Engineering, 04.07.2019 19:10
What is the main objective of using reheat rankine cycle?
Answers: 3
question
Engineering, 04.07.2019 19:20
Acommercial grade cubical freezer, 4 m on a side, has a composite wall consisting of an exterior sheet of 5.0-mm thick plain carbon steel (kst= 60.5 w/m k), an intermediate layer of 100-mm thick polyurethane insulation (kins 0.02 w/m k), and an inner sheet of 5.0- mm thick aluminium alloy (kal polyurethane insulation and both metallic sheets are each characterized by a thermal contact resistance of r 2.5 x 104 m2 k/w. (a) what is the steady-state cooling load that must be maintained by the refrigerator under conditions for which the outer and inner surface temperatures are 25°c and -5°c, respectively? (b) for power saving purpose, which wall material should be increased/reduced in. thickness in order to reduce 50% of the cooling load found in part (a)? redesign the thickness of the proposed material. 177 w/m-k). adhesive interfaces between the q=575.93 w
Answers: 2
question
Engineering, 04.07.2019 19:20
Apure substance is a)-mixture of various chemical elements or compounds b)-substance that has a fixed chemical composition throughout c)-mixture that is homogeneous (such as air) d)-all the answers
Answers: 3
question
Engineering, 06.07.2019 02:30
1in2 processor chip can be modelled as an isothermal plane wall of silicon, isothermal on both sides. the power input to the bottom of the plane wall, or the processing power of the chip, often called the thermal design power (tdp), is 100w. assume the periphery is adiabatic. the silicon is 400 microns thick. the temperature at the junction, or in this case on the bottom of the isothermal plane wall, is 85°c. what is the top surface temperature, assuming that the only mode of heat transfer is conduction
Answers: 1
You know the right answer?
Water flowing in a horizontal 25-cm-diameter pipe at 9 m/s and 300 kpa gage enters a 90° bend reduci...
Questions
question
Mathematics, 06.05.2020 00:14