Forced air at 25c and 10m/s is used to cool chips on a circuit board. consider a chip, 4mm x 4mm, located 120mm from the leading edge of the board. an empirical correlation has been established for the local nusselt number: 3185.0xxprre04.0nu= estimate the surface temperature of the chip if it is dissipating 30mw. (thermophysical properties of air at 25c are needed to solve this problem. state your reference source for this information.)

Apump is used to circulate hot water in a home heating system. water enters the well-insulated pump operating at steady state at a rate of 0.42 gal/min. the inlet pressure and temperature are 14.7 lbf/in.2, and 180°f, respectively; at the exit the pressure is 60 lbf/in.2 the pump requires 1/15 hp of power input. water can be modeled as an incompressible substance with constant density of 60.58 lb/ft3 and constant specific heat of 1 btu/lb or. neglecting kinetic and potential energy effects, determine the temperature change, in °r, as the water flows through the pump.

Draw the engineering stress-strain curve for (a) bcc; (b) fcc metals and mark important points.

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