The heat generated in the circuitry on the surface of a silicon chip (k=130 w/m°c) is conducted to the ceramic substrate to which it is attached. the chip is 6 mm × 6 mm in size and 0.5 mm thick and dissipates 3 w of power. disregarding any heat transfer through the 0.5 mm high side surfaces, determine the temperature difference between the front and back surfaces of the chip in steady operation

What difference(s) did you notice using a pneumatic circuit over hydraulic circuit.explain why the pneumatic piston stumbles when it hits an obstacle.

Air is to be cooled in the evaporator section of a refrigerator by passing it over a bank of 0.8-cm-outer-diameter and 0.4-m-long tubes inside which the refrigerant is evaporating at -20°c. air approaches the tube bank in the normal direction at 0°c and 1 atm with a mean velocity of 4 m/s. the tubes are arranged in-line with longitudinal and transverse pitches of sl- st 1.5 cm. there are 30 rows in the flow direction with 15 tubes in each row. determine (a) the refrigeration capacity of this system and (b) pressure drop across the tube bank. evaluate the air properties at an assumed mean temperature of -5°c and 1 atm. is this a good assumption?

Ifa component is made of two or more materials with different modulus of elasticity (e), it is called a composite member and we calculate the factor·n". mention the formula for calculating n". also, ifn> 1, explain what will happen to the 1. transformed.gi) ifn 1, what will happen to the material when transformed material when