Engineering, 06.07.2019 02:30 khalilh1206
1in2 processor chip can be modelled as an isothermal plane wall of silicon, isothermal on both sides. the power input to the bottom of the plane wall, or the processing power of the chip, often called the thermal design power (tdp), is 100w. assume the periphery is adiabatic. the silicon is 400 microns thick. the temperature at the junction, or in this case on the bottom of the isothermal plane wall, is 85°c. what is the top surface temperature, assuming that the only mode of heat transfer is conduction
Answers: 1
Engineering, 04.07.2019 18:10
Aflywheel accelerates for 5 seconds at 2 rad/s2 from a speed of 20 rpm. determine the total number of revolutions of the flywheel during the period of its acceleration. a.5.65 b.8.43 c. 723 d.6.86
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Engineering, 04.07.2019 18:10
Give heat transfer applications for the following, (i) gas turbines (propulsion) ) gas turbines (power generation). (iii) steam turbines. (iv) combined heat and power (chp). (v) automotive engines
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Engineering, 04.07.2019 19:10
What is the major difference between thermoplastics and thermosetting plastics from the polymerization structure point of view?
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Engineering, 04.07.2019 19:10
A)-in the process of engineering design, explain the contribution of material selection. b)- explain the procedure of synthesis as is employed in engineering design. c)- is there any relationship between ergonomics and engineering design? explain. d)- safety consideration in engineering design includes human, product and the enviroment . explain how safety will be incorporated into the design?
Answers: 3
1in2 processor chip can be modelled as an isothermal plane wall of silicon, isothermal on both sides...
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